CONF-MSS 2026
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Title:

Advanced Composite Materials and Polymer Chemistry: Flexible Biomedical Electronics

Date:

June 19, 2026 (UTC +3)

Organizer:

Department of Biomedical Engineering, Faculty of Engineering, Çukurova University

Symposium Chair:

Dr. Mustafa Istanbullu

Assistant Professor in Çukurova University

Personal Bio:

Dr. Mustafa Istanbullu is an assistant professor and vice chair of the undergraduate program in Biomedical Engineering at Çukurova University, where he has been working since 2021. He received his Bachelor's degree in Electrical and Electronics Engineering and later earned a master's degree in Biomedical Engineering from the Istanbul Technical University.

For his master's thesis, he focused on the early diagnosis of osteoporosis using artificial neural networks and support vector machines. He then pursued his PhD at Çukurova University, where his research centered around the design and simulation of a carbon nanotube hybridized field-effect transistor biopotential sensor.

His research interests include microelectronics, microfabrication of semiconductor devices, modeling of electronic devices, analog/digital circuit design, and biomedical instrumentation. He has published articles in international scientific journals and has received an international patent in 2021 for his invention of an ANN-based single calibration impedance measurement system for skin impedance range. He is committed to advancing the field of biomedical engineering and providing his students with an exceptional education.

Committee Members:

Dr. Ömer Burak Istanbullu, Eskişehir Osmangazi University, Turkey, oburak.istanbullu@ogu.edu.tr

Mustafa Borazan, Çukurova University, Turkey, mstfaborazan@gmail.com

Call for Papers

Background:

Flexible electronics have emerged as a transformative technology enabling next-generation biomedical sensors that conform to soft biological tissues. Among flexible substrate materials, polyimide stands out due to its excellent thermal stability, mechanical flexibility, chemical resistance, and compatibility with microfabrication processes. Recent advances in polymer chemistry and composite engineering have enabled the integration of conductive fillers, nanomaterials, and biocompatible coatings into polyimide matrices, resulting in multifunctional composite platforms. These developments support applications ranging from wearable health monitors to implantable biosensors and soft bioelectronic interfaces. The convergence of composite materials science and flexible electronics is opening new pathways for reliable, lightweight, and cost-effective biomedical sensing technologies.

Goal/Rationale:

Despite significant progress, challenges remain in developing flexible biomedical sensors that combine mechanical durability, biocompatibility, electrical stability, and scalable fabrication. Polyimide-based composites offer a promising solution by enabling tunable mechanical and electrical properties through polymer chemistry and material engineering. This symposium aims to explore recent advances in polyimide composites for flexible electronics, focusing on their role in wearable and implantable biomedical sensors.

Key topics include conductive composite formulations, integration of nanomaterials (e.g., graphene, CNTs), microfabrication on flexible substrates, encapsulation strategies, and long-term reliability in physiological environments. The symposium will also address translational challenges such as manufacturability, cost reduction, and regulatory considerations. By bringing together researchers from materials science, polymer chemistry, electronics, and biomedical engineering, the symposium seeks to foster interdisciplinary collaboration and accelerate the development of next-generation flexible bioelectronic systems.

Scope and Information for Participants:

This symposium invites contributions addressing the design, fabrication, characterization, and application of polyimide-based composite materials in flexible biomedical electronics. Topics of interest include:

  • Polyimide composite materials with conductive fillers and nanomaterials
  • Flexible and stretchable biosensor architectures
  • BioMEMS fabrication on polymer substrates
  • Biocompatible coatings and encapsulation methods
  • Wearable and implantable sensor applications
  • Reliability and performance in physiological conditions
  • Low-cost and scalable manufacturing approaches
  • Integration with wireless and portable health monitoring systems

The symposium is intended for researchers, engineers, and industry professionals working in materials science, polymer chemistry, biomedical engineering, and flexible electronics. Participants will gain insights into emerging materials, fabrication strategies, and interdisciplinary approaches shaping the future of biomedical sensing technologies.

Topics:

The main topics of this symposium are listed below.

Materials and Chemistry

  • Advanced Materials and Technologies
  • Chemical Engineering
  • Chemical Reaction Engineering and Catalysis
  • Composite Materials
  • Physical and Organic Chemistry
  • Polymer Chemistry
  • Polymer Science and Engineering

Meanwhile, submissions aligned with the overall conference theme are also welcome.

Mechanics and Automation

  • Machine Design
  • Mechanical CAD/CAM
  • Mechanical Power Engineering
  • Mechanical Dynamics
  • Process Control & Instrumentation
  • Flexible Manufacturing Systems
  • Integrated Manufacturing
  • Precision Manufacturing & Measurement
  • Fault Detection and Diagnostics
  • Physical System Modelling
  • Manufacturing Automation
  • Industrial Automation
  • Micro- and Nano-scale Automation
  • Advanced Intelligent Mechatronics
  • Machine Vision System
  • Human-Machine Interaction
  • Real-time Systems

Robotics

  • Mechatronics and Robotics
  • Bio-inspired Robotics
  • Evolutional Robotics
  • Field Robotics
  • Manufacturing Robotics
  • Healthcare Robotics and Medical Robotics
  • Wearable Exoskeleton and Powered Exoskeleton
  • Parallel Robots and Manipulators
  • Robotic Cognition and Emotion
  • Robotic Perception and Decision
  • Human-Robot Interaction
  • Control Algorithms and Control Systems
  • Kinematics and Dynamics Analysis
  • Mathematical and Computational Methodologies in Robotics

Electronics and Sensors

  • Sensors / Actuators
  • Sensor Design, Sensor Fusion, Sensor Networks
  • Sensing and Measurement in Electromechanical Systems
  • Intelligent Sensing and Control
  • Micro-nano Electromechanical System
  • Micro and Nano Mechatronics
  • Mechatronics in MEMS
  • Microfluidic Technology

Smart System

  • Smart Grids, Smart Power Delivery Systems
  • Power Engineering
  • Distributed Generation Systems
  • High Voltage Systems
  • Power Quality (PQ)
  • Power System Reliability
  • Transportation and Traffic Engineering
  • Power Electronics and Drives
  • Electric Motors and Transformers
  • Grid to Vehicle (G2V) and Vehicle to Grid (V2G)
  • Electric Vehicles
  • Autonomous Driving
  • Smart Transportation and Smart City
  • Civil Engineering

Submission:

Prospective authors are kindly invited to submit full papers that include title, abstract, introduction, tables, figures, conclusion and references. It is unnecessary to submit an abstract in advance. Please submit your papers in English.

Each paper should be no less than 4 pages. One regular registration can cover a paper of 6 pages, and additional pages will be charged. Please format your paper well according to the conference template before submission. Paper Template Download

Please prepare your paper in both .doc/.docx and .pdf format and submit your full paper by email with both formats attached directly to sympo_adana@confmss.org

Important Dates:

Process Date & Time
Submission Deadline June 12, 2026
Symposium Date June 19, 2026
Notification of Acceptance 7-20 workdays
Fees (VAT Included) Amount
Registration and Publishing Fee (6 pages included) $450
Additional Page (per extra page) $40

Publication:

Accepted papers of the symposium will be published in Applied and Computational Engineering (ACE) (Print ISSN 2755-2721), and will be submitted to Conference Proceedings Citation Index (CPCI), Crossref, CNKI, Portico, Engineering Village (Inspec), Google Scholar, and other databases for indexing. The situation may be affected by factors among databases like processing time, workflow, policy, etc.

Publication info

Title: Applied and Computational Engineering (ACE)
Press: EWA Publishing, United Kingdom
ISSN: 2755-2721 2755-273X (electronic)

This symposium is organized by CONF-MSS 2026 and it will independently proceed the submission and publication process.

* The papers will be exported to production and publication on a regular basis. Early-registered papers are expected to be published online earlier.

Ways to Participate

Venue:

Çukurova Üniversitesi, Mühendislik Fakültesi, Biyomedikal Mühendisliği Bölümü, Balcalı Kampüsü, 01330 Sarıçam/ADANA, Turkey.

Attend in person:

If you want to attend the symposium on-site, please email sympo_adana@confmss.org. The symposium seats are limited. Both contributors and non-contributors who wish to participate in the symposium in person need to apply to the symposium organizers.

VISA:

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My scientific studies have afforded me great gratification; and I am convinced that it will not be long before the whole world acknowledges the results of my work.