| Submission Deadline | Notification of Acceptance | Submission Email | Download |
|---|---|---|---|
| June 12, 2026 | 7-20 workdays | sympo_adana@confmss.org | Manuscript Template |
This symposium invites contributions addressing the design, fabrication, characterization, and application of polyimide-based composite materials in flexible biomedical electronics. Topics of interest include:
The symposium is intended for researchers, engineers, and industry professionals working in materials science, polymer chemistry, biomedical engineering, and flexible electronics. Participants will gain insights into emerging materials, fabrication strategies, and interdisciplinary approaches shaping the future of biomedical sensing technologies.
This symposium welcomes submissions with the following topics
Meanwhile, submissions aligned with the overall conference theme are also welcome.